IMF Working Papers

Markets for Corporate Debt Securities

By T. Todd Smith

July 1, 1995

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T. Todd Smith Markets for Corporate Debt Securities, (USA: International Monetary Fund, 1995) accessed December 7, 2024
Disclaimer: This Working Paper should not be reported as representing the views of the IMF.The views expressed in this Working Paper are those of the author(s) and do not necessarily represent those of the IMF or IMF policy. Working Papers describe research in progress by the author(s) and are published to elicit comments and to further debate

Summary

This paper surveys markets for corporate debt securities in the major industrial countries and the international markets. The discussion includes a comparison of the sizes of the markets for various products, as well as the key operational, institutional, and legal features of primary and secondary markets. Although there are some signs that debt markets may be emphasized in the future by some countries, it remains true that North American debt markets are the most active and liquid in the world. The international debt markets are, however, growing in importance. The paper also investigates some of the reasons for the underdevelopment of domestic bond markets and the consequences of firms shifting their debt financing needs from banks to securities markets.

Subject: Bank credit, Bonds, Corporate bonds, Financial institutions, Financial markets, Money, Securities, Securities markets

Keywords: Bank credit, Bonds, Convertible bond, Corporate bond bond market, Corporate bonds, CP market, Debt securities market, Deutsche mark, Equity issue, Eurobond issue, Europe, Government bond, Insider trading, Junk bond, MTN market, Parent company, Primary market, Secondary market, Securities, Securities markets, Standard and Poor's, Treasury obligations, U.S. dollar, WP

Publication Details

  • Pages:

    88

  • Volume:

    ---

  • DOI:

    ---

  • Issue:

    ---

  • Series:

    Working Paper No. 1995/067

  • Stock No:

    WPIEA0671995

  • ISBN:

    9781451848878

  • ISSN:

    1018-5941